A novel gas molecule decreasing global warming potential in semiconductor manufacturing.
In order to make specific architectures, making semiconductor device structures requires a number of gas-phase processes that control the growth and removal of materials. Air Liquide made a new line of advanced etching specialty gases to help the semiconductor industry deal with both technological and environmental problems in the future. It helps semiconductor customers in two ways. First, it helps them deal with their new technical challenges for more advanced and complicated devices. Second, it helps the environment by reducing the GWP footprint of their fab.
Positive facts about enScribe™ Product line
Reduces the process time by 50%
Improving a-C mask selectivity 3-4 times compared with C4F6
A thousand time smaller (1/1000) GWP compared with conventional fluorocarbons (a-C4F8)
enScribe™ G1 gas reduces clients fab CO2 emission by 4% – equivalent to the reduction of CO2 emission from 29,000 cars,
Less than 5 years payback time
Improve yield by 10 % compared to mainstream alternative
Video about enScribe™ Product line
https://www.youtube.com/embed/gUkvpUuJvBc
enScribe™ Product line website : https://electronics-airliquide.com/our-brands/enscribe
